New Product Information
Metal-Bonded Wheel Forming Machine EDT300
Metal-bonded wheels are highly productive, highly efficient for grinding cemented carbide and have a long life, but their modification and molding are extremely difficult. EDT300 makes it easy to modify and mold.Find out more about EDT300
Ultra Compact Surface Grinder R011
Ultra Compact Surface Grinder with a front width of 600 mm, ideal for grinding small parts.Find out more about R011
The lineup includes a metal grinding type and a hard-brittle material grinding type for SiC and GaN. Continuous grinding is possible in combination with the Ultra Compact Centerless Grinder C1003.
Ultra Compact Centerless Grinder C1003Small parts in a small machine!
Auxiliary equipment such as a coolant tank is all-in-one inside the machine.
Center dressing system allows fully automatic dressing of the grinding wheel, regulating wheel and automatic center height setting. One-touch fine adjustment by NC blade up/down mechanism. Same grinding wheel for outer diameter end-face. Continuous grinding is possible by connecting with "Ultra Compact Surface Grinder R011". Find out more about C1003
Centerless Grinder C6030TH
Centerless Grinder C6060
Wheel peripheral speed of 80m/sec. high-speed, high-precision grinding with CBN and thermal displacement control. Greatly reduced dressing time, significantly reduced wheel replacement time and blade replacement time.Find out more about C6060
Vertical Spindle Type Grinder VGF300
Double Disc Grinder (Vertical Spindle) KVD350
High rigidity with a BOX structure bed - Reduction of thermal displacement by thermal rigidity. Flat flow channel and large drainage opening to prevent sludge accumulation. The "Metal bonded grinding wheel" and "High rigidity due to the BOX structure bed" are effective in grinding ultra-hard materials. Wheel replacement - Maintenance can be done through the side door of the machine.Find out more about KVD350
ID Grinder KIH80 Ⅱ
High precision, high speed grinding and small footprint bearing internal grinder. Depending on the machining specifications, the workhead can be selected from "Two rollers-one shoe type or Two-shoe magnet chuck type".Find out more about KIH80Ⅱ
Multi-Head Grinder VGM5
High precision and high speed grinding through process integration! The largest machine in the VG series.Find out more about VGM5
One chuck for high-precision machining of inner and outer diameters and end faces.
Hard and Brittle Wafers Grinder R631DFGrinding of wafers (SiC, GaN, sapphire, etc.).
Allows you to store and traceability of grinding data for each wafer.
High-Precision Mirror Surface Grinder that can be replaced from lapping machines. Find out more about R631DF