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New Product Information

  • Metal-Bonded Wheel Forming Machine EDT300

    Metal-bonded wheels are highly productive, highly efficient for grinding cemented carbide and have a long life, but their modification and molding are extremely difficult. EDT300 makes it easy to modify and mold.

    Find out more about EDT300
  • Ultra Compact Surface Grinder R011

    Ultra Compact Surface Grinder with a front width of 600 mm, ideal for grinding small parts.
    The lineup includes a metal grinding type and a hard-brittle material grinding type for SiC and GaN. Continuous grinding is possible in combination with the Ultra Compact Centerless Grinder C1003.

    Find out more about R011
  • Ultra Compact Centerless Grinder C1003

    Small parts in a small machine!

    Auxiliary equipment such as a coolant tank is all-in-one inside the machine.
    Center dressing system allows fully automatic dressing of the grinding wheel, regulating wheel and automatic center height setting. One-touch fine adjustment by NC blade up/down mechanism. Same grinding wheel for outer diameter end-face. Continuous grinding is possible by connecting with "Ultra Compact Surface Grinder R011". Find out more about C1003
  • Centerless Grinder C6030TH

    Through-feed Centerless Grinder that greatly reduces the time required for setup and adjustment through automation and guidance.

    Find out more about C6030TH
  • Centerless Grinder C6060

    Wheel peripheral speed of 80m/sec. high-speed, high-precision grinding with CBN and thermal displacement control. Greatly reduced dressing time, significantly reduced wheel replacement time and blade replacement time.

    Find out more about C6060
  • Vertical Spindle Type Grinder VGF300

    Modular of grinding units. "Multi-surface continuous grinding line" by connecting VGF300 of different grinding units. Equipped with a wire transfer robot as standard.

    Find out more about VGF300
  • Double Disc Grinder (Vertical Spindle) KVD350

    High rigidity with a BOX structure bed - Reduction of thermal displacement by thermal rigidity. Flat flow channel and large drainage opening to prevent sludge accumulation. The "Metal bonded grinding wheel" and "High rigidity due to the BOX structure bed" are effective in grinding ultra-hard materials. Wheel replacement - Maintenance can be done through the side door of the machine.

    Find out more about KVD350
  • ID Grinder KIH80

    High precision, high speed grinding and small footprint bearing internal grinder. Depending on the machining specifications, the workhead can be selected from "Two rollers-one shoe type or Two-shoe magnet chuck type".

    Find out more about KIH80
  • Multi-Head Grinder VGM5

    High precision and high speed grinding through process integration! The largest machine in the VG series.
    One chuck for high-precision machining of inner and outer diameters and end faces.

    Find out more about VGM5
  • Hard and Brittle Wafers Grinder R631DF

    Grinding of wafers (SiC, GaN, sapphire, etc.).

    Allows you to store and traceability of grinding data for each wafer.
    High-Precision Mirror Surface Grinder that can be replaced from lapping machines. Find out more about R631DF

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